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| SD3932 RF power transistors HF/VHF/UHF N-channel MOSFETs Preliminary Data Features Gold metallization Excellent thermal stability Common source push-pull configuration POUT = 350 W min. with 26.8 dB gain @ 123 MHz In compliance with the 2002/95/EC european directive M244 Epoxy sealed Description The SD3932 is a gold metallized N-channel MOS field-effect RF power transistor. It is intended for use in 100V DC large signal applications up to 250MHz. Figure 1. Pin connection 1 3 2 1 3 2 1. Drain 2. Gate 3. Source Table 1. Device summary Marking SD3932 Package M244 Packaging Plastic tray Order code SD3932 October 2007 Rev 4 1/14 www.st.com 14 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. Contents SD3932 Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 1.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 4 5 6 7 8 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 SD3932 Electrical data 1 1.1 Electrical data Maximum ratings Table 2. Symbol V(BR)DSS(1) VDGR VGS ID PDISS Tj TSTG 1. TJ = 150C Absolute maximum ratings (TCASE = 25C) Parameter Drain source voltage Drain-gate voltage (RGS = 1M) Gate-source voltage Drain current Power dissipation Max. operating junction temperature Storage temperature Value 250 250 20 20 500 200 -65 to +150 Unit V V V A W C C 1.2 Thermal data Table 3. Symbol RthJC Thermal data Parameter Junction - case thermal resistance Value 0.35 Unit C/W 3/14 Electrical characteristics SD3932 2 Electrical characteristics TCASE = +25 oC 2.1 Static Table 4. Symbol V(BR)DSS(1) VGS = 0 V IDSS IGSS VGS(Q) VDS(ON) GFS CISS COSS CRSS VGS = 0 V VGS = 20 V VDS = 10 V VGS = 10 V VDS = 10 V VGS = 0 V VGS = 0 V VGS = 0 V Static (per side) Test conditions IDS = 100 mA VDS = 100 V VDS = 0 V ID = 250 mA ID = 5A ID = 2.5 A VDS = 100 V VDS = 100 V VDS = 100 V f = 1 MHz f = 1 MHz f = 1 MHz 3 500 134 6 1.5 2.5 2.5 Min. 250 1 250 4.0 3.5 Typ. Max. Unit V mA nA V V S pF pF pF 1. TJ = 150C 2.2 Dynamic Table 5. Symbol P1dB GPS hD VDD = 100 V Dynamic Test conditions IDQ = 2 x 250 mA f = 123MHz Min. 350 Typ. 425 26.8 66 3:1 Max. Unit W dB % VSWR VDD = 100 V, IDQ = 2 x 250mA, POUT = 350W,f = 123MHz VDD = 100 V, IDQ = 2 x 250mA, POUT = 350W,f = 123MHz VDD = 100 V, IDQ = 2 x 250mA, POUT = 300W,f = 123MHz Load mismatch All phase angles 4/14 SD3932 Impedance data 3 Impedance data Figure 2. Impedance data D ZDL Typical Input Impedance Typical Drain Load Impedance G Zin S Table 6. Impedance data Freq ZIN () 1.4 - j 5.5 0.7 - j 3.9 ZDL () 6.4 + j 10.2 3.2 + j 15 123 MHz (800W Peak) 123 MHz (350W CW) 5/14 Typical performance SD3932 4 Typical performance Figure 3. Capacitances vs voltage 1000 Coss 900 800 Capacitances (pF) 700 600 500 400 300 200 100 0 0 20 40 60 Vds (V) 80 100 120 Crss Ciss Freq = 1 MHz Figure 4. Transient thermal impedance 0.25 Zth , Transient Thermal Impedance , Deg C/W DF = 50% 0.2 DF = 20% 0.15 DF = 10% 0.1 0.05 0 1.0E -04 Single Pulse 1.0E-03 1.0E-02 1.0E -01 1.0E+00 Rectangular Pulse Width , Seconds 6/14 SD3932 Typical performance Figure 5. 100 Maximum safe operating area Operation limited by Rds(on) 100 S Ids(A) 1 mS 10 10 mS Tc = +25 C Tj = +200 C SINGLE PULSE 1 1 10 100 100 mS DC 1000 Vds(V) Figure 6. Zero temperature coefficient point + 25C 10 9 8 7 6 5 4 3 2 1 0 1 1.5 2 - 55C +125C ZTC POINT Ids(A) 2.5 3 3.5 4 4.5 5 5.5 6 Vgs(V) 7/14 Typical performance SD3932 Figure 7. 500 450 400 350 Pout (W) 300 250 200 150 100 50 0 0.0 Pout & efficiency vs pin - CW 100 Pout Eff 90 80 70 Figure 8. 30 29 28 27 Gain(dB) Gain vs output power - CW Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 50 40 30 Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 0.5 Pin (W) 1.0 1.5 20 10 0 Pout (W) 60 Nd (%) 26 25 24 23 22 21 20 0 50 100 150 200 250 300 350 400 450 500 Pin (W) Pout(W) Figure 9. 1000 900 800 700 Pout (W) 600 500 400 300 200 100 0 0.0 Pout & efficiency vs pin power 1 msec - 10% 100 Pout Eff 90 80 70 Figure 10. Gain vs output power 1 msec - 10% 30 29 28 27 Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA Gain(dB) Pout (W) 60 Nd (%) 50 40 30 Freq = 123 MHz Vdd = 100V Idq = 2 x 250mA 2.0 4.0 Pin (W) 6.0 8.0 20 10 0 26 25 24 23 22 21 20 0 100 200 300 400 500 600 700 800 900 Pin (W) Pout(W) 8/14 SD3932 Test circuit 5 Test circuit Figure 11. Test circuit Table 7. Bill of materials Description 120 pF ATC 100B chip capacitor 1-20 pf Johanson variable capacitor 51 pF ATC 100B chip capacitor 750 pF ATC 700B chip capacitor 43 pF ATC 100B chip capacitor 20 pF ATC 100B chip capacitor 1000 pF ATC 100C chip capacitor 43 pF ATC 100B chip capacitor 2200 pF ATC 100C chip capacitor 1200 pF ATC 100C chip capacitor 1K ohm 1/4 watt chip resistor 1K ohm 1/2 watt axial lead resistor 3 turns, 16 ga magnet wire, Id 3/8", 95 nH Fair-Rite # 2743019447 20 ga teflon coated wire thru copper tube OD 1/8"x 1.3" 20 ga teflon coated wire thru 4 copper tubes OD 1/8"x 1.5" .135" x .155" microstrip .420" x .350" microstrip Component C1 C2 C3 C4, C5 C6 C7 C8 C9 C10 C11 R1, R2 R3, R4 L1 FB1, FB2 B1 T1 TL1 TL2, TL3 9/14 Circuit layout Table 7. Bill of materials (continued) Description .220" x .350" microstrip .350" x .660" microstrip .225" x .200" microstrip .175" x .250" microstrip .062" FR-4 SD3932 Component TL4, TL5 TL6, TL7 TL8 TL9 Board 6 Circuit layout Figure 12. Circuit layout photo 10/14 SD3932 Package mechanical data 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/14 Package mechanical data Table 8. Dim. Min A B C D E F G H I J K L M N 33.91 0.10 1.52 2.59 4.83 10.03 21.59 3.02 9.65 19.81 10.92 27.94 34.16 0.15 1.78 2.84 5.84 10.34 22.10 1.335 0.004 0.060 0.102 0.190 0.395 0.850 5.59 5.08 3.28 9.91 20.82 11.18 0.119 0.380 0.780 0.430 1.100 Typ Max 5.84 Min 0.220 0.200 Typ SD3932 M244 (.400 x .860 4/L BAL N/HERM W/FLG) mechanical data mm. Inch Max 0.230 0.129 0.390 0.820 0.440 1.345 0.006 0.070 0.112 0.230 0.407 0.870 Figure 13. Package dimensions Controlling Dimension: Inches 1020876B 12/14 SD3932 Revision history 8 Revision history Table 9. Date 09-Sep-2003 03-Jul-2007 07-Aug-2007 31-Oct-2007 Document revision history Revision 1 2 3 4 First release Specification upgrade Updated: Cover page, Figure 7, 8, 9, 10 on page 8 Updated: Table 4: Static (per side) on page 4 Added Section 5: Test circuit on page 8, Section 6: Circuit layout on page 10 Changes 13/14 SD3932 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 |
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